Compact thermal modeling for temperature-aware design

  • Authors:
  • Wei Huang;Mircea R. Stan;Kevin Skadron;Karthik Sankaranarayanan;Shougata Ghosh;Sivakumar Velusam

  • Affiliations:
  • University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA

  • Venue:
  • Proceedings of the 41st annual Design Automation Conference
  • Year:
  • 2004

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Abstract

Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.