The SimpleScalar tool set, version 2.0
ACM SIGARCH Computer Architecture News
Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
Cache decay: exploiting generational behavior to reduce cache leakage power
ISCA '01 Proceedings of the 28th annual international symposium on Computer architecture
Algorithms for VLSI Physical Design Automation
Algorithms for VLSI Physical Design Automation
Design Challenges of Technology Scaling
IEEE Micro
Basic Block Distribution Analysis to Find Periodic Behavior and Simulation Points in Applications
Proceedings of the 2001 International Conference on Parallel Architectures and Compilation Techniques
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Design and implementation of the POWER5™ microprocessor
Proceedings of the 41st annual Design Automation Conference
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
Distributing the Frontend for Temperature Reduction
HPCA '05 Proceedings of the 11th International Symposium on High-Performance Computer Architecture
Analytical Model for Sensor Placement on Microprocessors
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Optimizing the Thermal Behavior of Subarrayed Data Caches
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
An analytical model for the upper bound on temperature differences on a chip
Proceedings of the 18th ACM Great Lakes symposium on VLSI
Thermal monitoring mechanisms for chip multiprocessors
ACM Transactions on Architecture and Code Optimization (TACO)
Temperature-aware register reallocation for register file power-density minimization
ACM Transactions on Design Automation of Electronic Systems (TODAES)
On process variation tolerant low cost thermal sensor design in 32nm CMOS technology
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Spectral techniques for high-resolution thermal characterization with limited sensor data
Proceedings of the 46th Annual Design Automation Conference
Characterizing processor thermal behavior
Proceedings of the fifteenth edition of ASPLOS on Architectural support for programming languages and operating systems
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Thermal monitoring of real processors: techniques for sensor allocation and full characterization
Proceedings of the 47th Design Automation Conference
Accurate direct and indirect on-chip temperature sensing for efficient dynamic thermal management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems - Special section on the ACM IEEE international conference on formal methods and models for codesign (MEMOCODE) 2009
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
Proceedings of the 49th Annual Design Automation Conference
An energy-efficient truly all-digital temperature sensor for SoC applications
Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI
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Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effects on reliability and performance of integrated circuits increases careful planning and embedding of thermal monitoring mechanisms into these systems will be crucial. Systematic tools for analysis of thermal behavior and determination of best allocation and placement of thermal sensing elements is therefore a highly relevant problem. In this paper, we propose novel optimization techniques for determining the optimal locations and allocations for thermal sensors to provide a high fidelity thermal profile of a complex microprocessor system. Our algorithm identifies an optimal physical location for each sensor such that the sensor's the attraction towards steep thermal gradient is maximized. We also present a hybrid allocation and placement strategy showing the trade-offs associated with number of sensors used and expected accuracy. Our results show that our tool is able to create a sensor distribution for a given microprocessor architecture providing thermal measurements with maximum error of 3.18°C and average maximum error of 1.63°C across a wide set of applications.