Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Runtime Power Monitoring in High-End Processors: Methodology and Empirical Data
Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture
Using Performance Counters for Runtime Temperature Sensing in High-Performance Processors
IPDPS '05 Proceedings of the 19th IEEE International Parallel and Distributed Processing Symposium (IPDPS'05) - Workshop 11 - Volume 12
Systematic temperature sensor allocation and placement for microprocessors
Proceedings of the 43rd annual Design Automation Conference
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
An analytical model for the upper bound on temperature differences on a chip
Proceedings of the 18th ACM Great Lakes symposium on VLSI
Thermal monitoring mechanisms for chip multiprocessors
ACM Transactions on Architecture and Code Optimization (TACO)
Thermal sensor allocation and placement for reconfigurable systems
ACM Transactions on Design Automation of Electronic Systems (TODAES)
A cost-effective load-balancing policy for tile-based, massive multi-core packet processors
ACM Transactions on Embedded Computing Systems (TECS)
Proceedings of the 19th international conference on Parallel architectures and compilation techniques
Accurate direct and indirect on-chip temperature sensing for efficient dynamic thermal management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems - Special section on the ACM IEEE international conference on formal methods and models for codesign (MEMOCODE) 2009
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
A novel software solution for localized thermal problems
ISPA'06 Proceedings of the 4th international conference on Parallel and Distributed Processing and Applications
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
A power-driven thermal sensor placement algorithm for dynamic thermal management
Proceedings of the Conference on Design, Automation and Test in Europe
Run-time probabilistic detection of miscalibrated thermal sensors in many-core systems
Proceedings of the Conference on Design, Automation and Test in Europe
| Hi-index | 0.00 |
Thermal management in microprocessors has become a major design challenge in recent years. Thermal monitoring through hardware sensors is important, and these sensors must be carefully placed on the chip to account for thermal gradients. In this paper, we present an analytical model that describes the maximum temperature differential between a hot spot and a region of interest based on their distance and processor packaging information. We also use a runtime thermal model, as an illustration of virtual sensors, and examine two benchmarks that exhibit highly concentrated thermal stress. We then use our analytical model to demonstrate the safety margins of the chip. Ultimately, the mathematical expression allows designers to obtain worstcase behavior of thermal heatup and select the optimal location of additional sensors.