A framework for dynamic energy efficiency and temperature management
Proceedings of the 33rd annual ACM/IEEE international symposium on Microarchitecture
Pentium 4 Performance-Monitoring Features
IEEE Micro
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
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Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
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Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture
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ASPLOS XI Proceedings of the 11th international conference on Architectural support for programming languages and operating systems
Using Performance Counters for Runtime Temperature Sensing in High-Performance Processors
IPDPS '05 Proceedings of the 19th IEEE International Parallel and Distributed Processing Symposium (IPDPS'05) - Workshop 11 - Volume 12
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ICCD '05 Proceedings of the 2005 International Conference on Computer Design
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ACM Transactions on Design Automation of Electronic Systems (TODAES)
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ACM Transactions on Architecture and Code Optimization (TACO)
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ACM Computing Surveys (CSUR)
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In this paper, we propose a temperature-aware DFS (Dynamic Frequency Scaling) technique using the performance counters that is already embedded in the commercial microprocessors. By using performance counters and simple regression analysis, we can predict the localized temperature and efficiently schedule the tasks considering the temperature. The proposed technique is especially beneficial to potential localized thermal problems that are inevitable due to limited number of costly CMOS thermal sensors. When localized thermal problems that were not detected by thermal sensors are found after fabrication, the thermal problems can be avoided by the proposed software solution without re-fabrication costs. The evaluation results show that the proposed technique is comparable to the DFS technique using CMOS thermal sensors.