Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
Automatically characterizing large scale program behavior
Proceedings of the 10th international conference on Architectural support for programming languages and operating systems
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Proceedings of the 30th annual international symposium on Computer architecture
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Comparing Program Phase Detection Techniques
Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture
Joint exploration of architectural and physical design spaces with thermal consideration
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Systematic temperature sensor allocation and placement for microprocessors
Proceedings of the 43rd annual Design Automation Conference
Proceedings of the 2006 international symposium on Low power electronics and design
Thermal sensor allocation and placement for reconfigurable systems
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Power model validation through thermal measurements
Proceedings of the 34th annual international symposium on Computer architecture
Analysis of redundancy and application balance in the SPEC CPU2006 benchmark suite
Proceedings of the 34th annual international symposium on Computer architecture
Valgrind: a framework for heavyweight dynamic binary instrumentation
Proceedings of the 2007 ACM SIGPLAN conference on Programming language design and implementation
Measuring Program Similarity: Experiments with SPEC CPU Benchmark Suites
ISPASS '05 Proceedings of the IEEE International Symposium on Performance Analysis of Systems and Software, 2005
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Power-constrained high-frequency circuits for the IBM POWER6 microprocessor
IBM Journal of Research and Development
Many-core design from a thermal perspective
Proceedings of the 45th annual Design Automation Conference
Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Proceedings of the eleventh international joint conference on Measurement and modeling of computer systems
Thread motion: fine-grained power management for multi-core systems
Proceedings of the 36th annual international symposium on Computer architecture
Chip integration methodology for the IBM S/390 G5 and G6 custom microprocessors
IBM Journal of Research and Development
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
PowerField: a transient temperature-to-power technique based on Markov random field theory
Proceedings of the 49th Annual Design Automation Conference
Thermal-aware sampling in architectural simulation
Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
Power Modeling and Characterization of Computing Devices: A Survey
Foundations and Trends in Electronic Design Automation
ACM Transactions on Architecture and Code Optimization (TACO)
Revisiting automated physical synthesis of high-performance clock networks
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Computational sprinting on a hardware/software testbed
Proceedings of the eighteenth international conference on Architectural support for programming languages and operating systems
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Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate thermal characteristics in their proposals. In this paper, we measure a real processor focusing on its thermal characterization executing diverse workloads. Our results show that in real designs, thermal transients operate at larger scales than their performance and power counterparts. Conventional thermal simulation methodologies based on profile-based simulation or statistical sampling, such as Simpoint, tend to explore very limited execution spans. Short simulation times can lead to reduced matchings between performance and thermal phases. To illustrate these issues we characterize and classify from a thermal standpoint SPEC00 and SPEC06 applications, which are traditionally used in the evaluation of architectural proposals. This paper concludes with a list of recommendations regarding thermal modeling considerations based on our experimental insights.