Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Performance, Energy, and Thermal Considerations for SMT and CMP Architectures
HPCA '05 Proceedings of the 11th International Symposium on High-Performance Computer Architecture
Heterogeneous Chip Multiprocessors
Computer
Techniques for Multicore Thermal Management: Classification and New Exploration
Proceedings of the 33rd annual international symposium on Computer Architecture
Design space exploration for multicore architectures: a power/performance/thermal view
Proceedings of the 20th annual international conference on Supercomputing
The BubbleWrap many-core: popping cores for sequential acceleration
Proceedings of the 42nd Annual IEEE/ACM International Symposium on Microarchitecture
A cost-effective load-balancing policy for tile-based, massive multi-core packet processors
ACM Transactions on Embedded Computing Systems (TECS)
Characterizing processor thermal behavior
Proceedings of the fifteenth edition of ASPLOS on Architectural support for programming languages and operating systems
Simultaneous PVT-tolerant voltage-island formation and core placement for thousand-core platforms
SOC'09 Proceedings of the 11th international conference on System-on-chip
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Thermal monitoring of real processors: techniques for sensor allocation and full characterization
Proceedings of the 47th Design Automation Conference
Post-silicon power characterization using thermal infrared emissions
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Exploring the effects of on-chip thermal variation on high-performance multicore architectures
ACM Transactions on Architecture and Code Optimization (TACO)
Improved post-silicon power modeling using AC lock-in techniques
Proceedings of the 48th Design Automation Conference
PowerField: a transient temperature-to-power technique based on Markov random field theory
Proceedings of the 49th Annual Design Automation Conference
Proceedings of the 49th Annual Design Automation Conference
Is dark silicon useful?: harnessing the four horsemen of the coming dark silicon apocalypse
Proceedings of the 49th Annual Design Automation Conference
Thermal management of a many-core processor under fine-grained parallelism
Euro-Par'11 Proceedings of the 2011 international conference on Parallel Processing
Post-silicon power mapping techniques for integrated circuits
Integration, the VLSI Journal
Architectural implications of spatial thermal filtering
Integration, the VLSI Journal
Cooperative boosting: needy versus greedy power management
Proceedings of the 40th Annual International Symposium on Computer Architecture
A multi-agent framework for thermal aware task migration in many-core systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Journal of Systems and Software
Fast and accurate thermal modeling and simulation of manycore processors and workloads
Microelectronics Journal
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Air cooling limits have been a major design challenge in recent years for integrated circuits. Multi-core exacerbates thermal challenges because power scales with the number of cores, but also creates new opportunities for temperature-aware design, because multi-core designs offer more design parameters than single-core designs. This paper investigates the relationship between core size and on-chip hot spot temperature and shows that with the same power density, smaller cores are cooler than larger cores due to a spatial low-pass filtering effect of temperature. This phenomenon suggests that designs exploiting low-pass filtering can dissipate more power within the same cooling budget than contemporary designs.