Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Proceedings of the 30th annual international symposium on Computer architecture
Wavelet Analysis for Microprocessor Design: Experiences with Wavelet-Based dI/dt Characterization
HPCA '04 Proceedings of the 10th International Symposium on High Performance Computer Architecture
Spectral analysis for characterizing program power and performance
ISPASS '04 Proceedings of the 2004 IEEE International Symposium on Performance Analysis of Systems and Software
Many-core design from a thermal perspective
Proceedings of the 45th annual Design Automation Conference
Analytical results for design space exploration of multi-core processors employing thread migration
Proceedings of the 13th international symposium on Low power electronics and design
Throughput optimal task allocation under thermal constraints for multi-core processors
Proceedings of the 46th Annual Design Automation Conference
Proceedings of the 2009 International Conference on Computer-Aided Design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ESD: Failure Mechanisms and Models
ESD: Failure Mechanisms and Models
Temperature and supply Voltage aware performance and power modeling at microarchitecture level
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Fast Thermal Simulation for Runtime Temperature Tracking and Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Today's microprocessors require careful analysis of their thermal behavior both at design time as well as at runtime. However, accurate prediction of thermal behavior is possible only through simulations due to the complexity and the high dynamicity of their operation. Unfortunately, accurate simulations of such complex systems are computationally intensive, therefore time consuming, while on the other hand, simplified models often cause mispredictions leading to overdesign and lowered performance. In our work, we propose a new discrete-time method of assessment of the run-time temperature of a processor based on an approximation of its instructions-per-cycle (IPC) by a finite Fourier series expansion. Our method is AC-based, and shows significant increase of accuracy in comparison to well-known DC (average)-based models. Furthermore, we provide a new Dynamic Voltage and Frequency Scaling (DVFS) model based on our estimations.