Post-silicon power mapping techniques for integrated circuits

  • Authors:
  • Sherief Reda;Abdullah N. Nowroz;Ryan Cochran;Stefan Angelevski

  • Affiliations:
  • School of Engineering, Brown University, 184 Hope St, Providence RI 02912, United States;School of Engineering, Brown University, 184 Hope St, Providence RI 02912, United States;School of Engineering, Brown University, 184 Hope St, Providence RI 02912, United States;School of Engineering, Brown University, 184 Hope St, Providence RI 02912, United States

  • Venue:
  • Integration, the VLSI Journal
  • Year:
  • 2013

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Abstract

We propose a new methodology for post-silicon power validation using the captured thermal infrared emissions from the back-side of operational integrated circuits. We first identify the challenges associated with thermal to power inversion, and then we address these challenges by devising a quadratic optimization formulation that incorporates Tikhonov filtering techniques to find the most accurate power maps. To validate our methodology, a programmable circuit of micro-heaters is implemented to create a number of reference power maps. The thermal emissions from the circuit are captured using an infrared camera and then inverted to yield highly accurate post-silicon power maps.