Extended Krylov subspace method for reduced order analysis of linear circuits with multiple sources
Proceedings of the 37th Annual Design Automation Conference
Basic Block Distribution Analysis to Find Periodic Behavior and Simulation Points in Applications
Proceedings of the 2001 International Conference on Parallel Architectures and Compilation Techniques
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
System level leakage reduction considering the interdependence of temperature and leakage
Proceedings of the 41st annual Design Automation Conference
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
Using Performance Counters for Runtime Temperature Sensing in High-Performance Processors
IPDPS '05 Proceedings of the 19th IEEE International Parallel and Distributed Processing Symposium (IPDPS'05) - Workshop 11 - Volume 12
EFFICIENT THERMAL SIMULATION FOR RUN-TIME TEMPERATURE TRACKING AND MANAGEMENT
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Thermal-Aware Testing of Network-on-Chip Using Multiple-Frequency Clocking
VTS '06 Proceedings of the 24th IEEE VLSI Test Symposium
Advanced Model Order Reduction Techniques in VLSI Design
Advanced Model Order Reduction Techniques in VLSI Design
Efficient power modeling and software thermal sensing for runtime temperature monitoring
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Thermal-Safe Test Scheduling for Core-Based System-on-Chip Integrated Circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Owning to increasing power consumption and the corresponding heat dissipated on die, efficient on-chip temperature regulation becomes imperative for today's high performance microprocessors. Temperature tracking based on the on-chip thermal sensors is not sufficient as the temperature hot spots keep changing with the load. One way to mitigate this problem is by means of software sensors, where temperature of any location is computed based on realtime power information and calibrated with the physical sensors. In this paper, we present a very efficient numerical thermal analyzer, which is suitable for fast temperature tracking and online thermal regulation. The proposed method, called FEKIS, combines two existing numerical techniques: extended Krylov subspace reduction technique to reduce the thermal circuit complexity and large-step integration method to exploits the piecewise constant power input traces, which is typical in the power traces at the architecture level. Experimental results show that FEKIS runs 10X faster than the precise time-step integration method only and $1000X$ faster than the traditional numerical integration method with high accuracy.