Design Challenges of Technology Scaling
IEEE Micro
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Making visible the thermal behaviour of embedded microprocessors on FPGAs: a progress report
FPGA '04 Proceedings of the 2004 ACM/SIGDA 12th international symposium on Field programmable gate arrays
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
Thermal sensor allocation and placement for reconfigurable systems
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Thermal characterization and optimization in platform FPGAs
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Thermal monitoring mechanisms for chip multiprocessors
ACM Transactions on Architecture and Code Optimization (TACO)
Designing a 3-D FPGA: switch box architecture and thermal issues
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Automated Design Space Exploration for DSP Applications
Journal of Signal Processing Systems
Multiscale thermal analysis for nanometer-scale integrated circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
A monitor interconnect and support subsystem for multicore processors
Proceedings of the Conference on Design, Automation and Test in Europe
Temperature-Power Consumption Relationship and Hot-Spot Migration for FPGA-Based System
GREENCOM-CPSCOM '10 Proceedings of the 2010 IEEE/ACM Int'l Conference on Green Computing and Communications & Int'l Conference on Cyber, Physical and Social Computing
Proceedings of the 38th annual international symposium on Computer architecture
WSEAS Transactions on Systems and Control
Low power FPGA design using post-silicon device aging (abstract only)
Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays
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FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatures and local hotspots. Sophisticated packaging techniques have become essential to maintain the health of the chip. In addition to static techniques to reduce the temperature, dynamic thermal management techniques are essential. Such techniques rely on accurate on-chip temperature information. In this paper, we present the design of a system that monitors the temperatures at various locations on the FPGA. This system is composed of a controller interfacing to an array of temperature sensors that are implemented on the FPGA fabric. Such a system can be used to implement dynamic thermal management techniques. We cross validate the sensor readings with values obtained from HotSpot, a pre-RTL architectural level thermal modeling tool.