Thermal Testing on Reconfigurable Computers
IEEE Design & Test
Monitoring Temperature in FPGA based SoCs
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Thermal sensor allocation and placement for reconfigurable systems
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Thermal characterization and optimization in platform FPGAs
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Closed-loop modeling of power and temperature profiles of FPGAs
Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays
Thermal sensor allocation and placement for reconfigurable systems
ACM Transactions on Design Automation of Electronic Systems (TODAES)
On-line sensing for healthier FPGA systems
Proceedings of the 18th annual ACM/SIGDA international symposium on Field programmable gate arrays
Thermal and power characterization of field-programmable gate arrays
Proceedings of the 19th ACM/SIGDA international symposium on Field programmable gate arrays
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Low-cost sensing with ring oscillator arrays for healthier reconfigurable systems
ACM Transactions on Reconfigurable Technology and Systems (TRETS)
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This paper shows a method to verifying the thermal status of complex FPGA-based circuits like microprocessors. Thus, the designer can evaluate if a particular block is working beyond specifications. The idea is to extract the output frequencies of an array of ring-oscillators previously distributed in the die, taking full advantage of the configuration port capabilities in Xilinx technology. As a result, it is shown that the FPGA technology offers the designers of embedded systems the possibility of viewing a detailed thermal map of a circuit at a minimum cost. The verification can be done in actual working conditions; for example with heat sinks and fans attached to the chip, inside the system case, or even in an on-board satellite application. The main results of the work are unthinkable using other alternatives like IR cameras, external sensors, or embedded diodes.