Dynamic power consumption in Virtex™-II FPGA family
FPGA '02 Proceedings of the 2002 ACM/SIGDA tenth international symposium on Field-programmable gate arrays
Making visible the thermal behaviour of embedded microprocessors on FPGAs: a progress report
FPGA '04 Proceedings of the 2004 ACM/SIGDA 12th international symposium on Field programmable gate arrays
A detailed power model for field-programmable gate arrays
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Thermal sensor allocation and placement for reconfigurable systems
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Measuring performance, power, and temperature from real processors
Proceedings of the 2007 workshop on Experimental computer science
Thermal sensor allocation and placement for reconfigurable systems
ACM Transactions on Design Automation of Electronic Systems (TODAES)
On-line sensing for healthier FPGA systems
Proceedings of the 18th annual ACM/SIGDA international symposium on Field programmable gate arrays
Thermal monitoring of real processors: techniques for sensor allocation and full characterization
Proceedings of the 47th Design Automation Conference
Post-silicon power characterization using thermal infrared emissions
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Power modeling and characteristics of field programmable gate arrays
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Power Modeling and Characterization of Computing Devices: A Survey
Foundations and Trends in Electronic Design Automation
Low power FPGA design using post-silicon device aging (abstract only)
Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays
Hi-index | 0.00 |
In this paper we propose new techniques for thermal and power characterization of Field Programmable Gate Arrays (FPGAs) using infrared imaging techniques. For thermal characterization, we capture the thermal emissions from the backside of an FPGA chip during operation. We analyze the captured emissions and quantify the extent of thermal gradients and hot spots in FPGAs. Given that FPGAs are fabricated with no knowledge of the potential field designs, we propose soft sensing techniques that can combine the measurements of hard sensors to accurately estimate the temperatures where no sensors are embedded. For power characterization, we propose algorithmic techniques to invert the thermal emissions from FPGAs into spatial power estimates. We demonstrate how this technique can be used to produce spatial power maps of soft processors during operation.