Fixed-outline thermal-aware 3D floorplanning

Authors:
Linfu Xiao;Subarna Sinha;Jingyu Xu;Evangeline F. Y. Young
Affiliations:
The Chinese University of Hong Kong, Shatin N. T., Hong Kong;Advanced Technology Group, Synopsys;Advanced Technology Group, Synopsys;The Chinese University of Hong Kong, Shatin N. T., Hong Kong
Venue:
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Year:
2010

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Abstract

In this paper, we present a novel algorithm for 3D floorplanning with fixed outline constraints and a particular emphasis on thermal awareness. A computationally efficient thermal model that can be used to guide the thermal-aware floorplanning algorithm to reduce the peak temperature is proposed. We also present a novel white space redistribution algorithm to dissipate hotspot. Thermal through-silicon via (TSV) insertion is performed during the floorplanning process as a means to control the peak temperature. Experimental results are very promising and demonstrate that the proposed floorplanning algorithm has a high success rate at meeting the fixed-outline constraints while effectively limiting the rise in peak temperature.