Statistical thermal modeling and optimization considering leakage power variations

Authors:
Da-Cheng Juan;Yi-Lin Chuang;Diana Marculescu;Yao-Wen Chang
Affiliations:
Carnegie Mellon University, PA;Taiwan Semiconductor Manufacturing Company, HsinChu, Taiwan;Carnegie Mellon University, PA;National Taiwan University, Taipei, Taiwan
Venue:
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Year:
2012

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Abstract

Unaddressed thermal issues can seriously hinder the development of reliable and low power systems. In this paper, we propose a statistical approach for analyzing thermal behavior under leakage power variations stemming from the manufacturing process. Based on the proposed models, we develop floorplanning techniques targeting thermal optimization. The experimental results show that peak temperature is reduced by up to 8.8°C, while thermal-induced leakage power and maximum thermal variance are reduced by 13% and 17%, respectively, with no additional area overhead compared with best performance-driven optimized design.