N4SID: subspace algorithms for the identification of combined deterministic-stochastic systems
Automatica (Journal of IFAC) - Special issue on statistical signal processing and control
Electrothermal analysis of VLSI systems
Electrothermal analysis of VLSI systems
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
The need for a full-chip and package thermal model for thermally optimized IC designs
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Predictive dynamic thermal management for multicore systems
Proceedings of the 45th annual Design Automation Conference
Parameterized architecture-level dynamic thermal models for multicore microprocessors
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Utilizing predictors for efficient thermal management in multiprocessor SoCs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Post-silicon power characterization using thermal infrared emissions
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Compact thermal modeling for package design with practical power maps
IGCC '11 Proceedings of the 2011 International Green Computing Conference and Workshops
General Parameterized Thermal Modeling for High-Performance Microprocessor Design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IEEE Transactions on Parallel and Distributed Systems
SCC thermal model identification via advanced bias-compensated least-squares
Proceedings of the Conference on Design, Automation and Test in Europe
| Hi-index | 0.00 |
In this paper, we propose a new behavioral thermal modeling technique for high-performance microprocessors at package level. Firstly, the new approach applies the subspace identification method with the consideration of practical power maps with correlated power signals. We show that the input power signal needs to meet an independence requirement to ensure the model predictability and propose an iterative process to build the models with given error bounds. Secondly, we show that thermal systems fundamentally are nonlinear and then propose a piecewise linear (PWL) scheme to deal with nonlinear effects. The experimental results validated the proposed method on a realistic packaged integrated system modeled by the multi-domain/physics commercial tool, COMSOL. The new piecewise linear models can model thermal behaviors over wide temperature ranges or over different thermal boundary convective conditions due to different fan speeds. Further, the PWL modeling technique can lead to much smaller model order without accuracy loss, which translates to significant savings in both the simulation time and the time required to identify the reduced models compared to the simple modeling method by using the high order models.