System identification (2nd ed.): theory for the user
System identification (2nd ed.): theory for the user
Temperature-constrained power control for chip multiprocessors with online model estimation
Proceedings of the 36th annual international symposium on Computer architecture
Utilizing predictors for efficient thermal management in multiprocessor SoCs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Consistent runtime thermal prediction and control through workload phase detection
Proceedings of the 47th Design Automation Conference
Accurate direct and indirect on-chip temperature sensing for efficient dynamic thermal management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems - Special section on the ACM IEEE international conference on formal methods and models for codesign (MEMOCODE) 2009
A system level approach to multi-core thermal sensors calibration
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
IEEE Transactions on Parallel and Distributed Systems
Compact thermal modeling for packaged microprocessor design with practical power maps
Integration, the VLSI Journal
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Compact thermal models and modeling strategies are today a cornerstone for advanced power management to counteract the emerging thermal crisis for many-core systems-on-chip. System identification techniques allow to extract models directly from the target device thermal response. Unfortunately, standard Least Squares techniques cannot effectively cope with both model approximation and measurement noise typical of real systems. In this work, we present a novel distributed identification strategy capable of coping with real-life temperature sensor noise and effectively extracting a set of low-order predictive thermal models for the tiles of Intel's Single-chip-Cloud-Computer (SCC) many-core prototype.