Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
Electrothermal analysis of VLSI systems
Electrothermal analysis of VLSI systems
Templates for the solution of algebraic eigenvalue problems: a practical guide
Templates for the solution of algebraic eigenvalue problems: a practical guide
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
Approximation of Large-Scale Dynamical Systems (Advances in Design and Control) (Advances in Design and Control)
Advanced Model Order Reduction Techniques in VLSI Design
Advanced Model Order Reduction Techniques in VLSI Design
A First Course in the Numerical Analysis of Differential Equations
A First Course in the Numerical Analysis of Differential Equations
Parameterized transient thermal behavioral modeling for chip multiprocessors
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Architecture-level thermal characterization for multicore microprocessors
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Understanding Power Efficiency of TCP/IP Packet Processing over 10GbE
HOTI '10 Proceedings of the 2010 18th IEEE Symposium on High Performance Interconnects
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A new server I/O architecture for high speed networks
HPCA '11 Proceedings of the 2011 IEEE 17th International Symposium on High Performance Computer Architecture
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Full-chip runtime error-tolerant thermal estimation and prediction for practical thermal management
Proceedings of the International Conference on Computer-Aided Design
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Poor man's TBR: a simple model reduction scheme
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Efficient temperature estimation is vital for designing thermally efficient, lower power and robust integrated circuits in nanometer regime. Thermal simulation based on the detailed thermal structures no longer meets the demanding tasks for efficient design space exploration. The compact and composable model-based simulation provides a viable solution to this difficult problem. However, building such thermal models from detailed thermal structures was not well addressed in the past. In this article, we propose a new compact thermal modeling technique, called ThermComp, standing for thermal modeling with composable modules. ThermComp can be used for fast thermal design space exploration for multicore microprocessors. The new approach builds the composable model from detailed structures for each basic module using the finite difference method and reduces the model complexity by the sampling-based model order reduction technique. These composable models are then used to assemble different multicore architecture thermal models and realized into SPICE-like netlists. The resulting thermal models can be simulated by the general circuit simulator SPICE. ThermComp tries to preserve the accuracy of fine-grained models with the speed of coarse-grained models. Experimental results on a number of multicore microprocessor architectures show the new approach can easily build accurate thermal systems from compact composable models for fast architecture thermal analysis and optimization and is much faster than the existing HotSpot method with similar accuracy.