IBM Journal of Research and Development - POWER5 and packaging
Silicon CMOS devices beyond scaling
IBM Journal of Research and Development - Advanced silicon technology
Three-dimensional integrated circuits
IBM Journal of Research and Development - Advanced silicon technology
Die Stacking (3D) Microarchitecture
Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture
Wafer-level 3D integration technology
IBM Journal of Research and Development
Embedded DRAM: technology platform for the Blue Gene/L chip
IBM Journal of Research and Development
Agent-based thermal management using real-time I/O communication relocation for 3D many-cores
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
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3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors.