Implementing Caches in a 3D Technology for High Performance Processors
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Silicon CMOS devices beyond scaling
IBM Journal of Research and Development - Advanced silicon technology
Three-dimensional integrated circuits
IBM Journal of Research and Development - Advanced silicon technology
Overlay as the key to drive wafer scale 3D integration
Microelectronic Engineering
Embedded DRAM: technology platform for the Blue Gene/L chip
IBM Journal of Research and Development
Why should we do 3D integration?
Proceedings of the 45th annual Design Automation Conference
Three-dimensional silicon integration
IBM Journal of Research and Development
Low-power 3D nano/CMOS hybrid dynamically reconfigurable architecture
ACM Journal on Emerging Technologies in Computing Systems (JETC)
An industrial perspective of 3D IC integration technology: from the viewpoint of design technology
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Homogeneous integration for 3D IC with TSV
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Quality factor and frequency bandwidth of 2D self-inductors in 3D integration stacks
Microelectronic Engineering
3D network-on-chip architectures using homogeneous meshes and heterogeneous floorplans
International Journal of Reconfigurable Computing - Special issue on selected papers from ReconFig 2009 International conference on reconfigurable computing and FPGAs (ReconFig 2009)
Layout effects in fine grain 3D integrated regular microprocessor blocks
Proceedings of the 48th Design Automation Conference
Architecture and performance evaluation of 3D CMOS-NEM FPGA
Proceedings of the System Level Interconnect Prediction Workshop
Cell transformations and physical design techniques for 3D monolithic integrated circuits
ACM Journal on Emerging Technologies in Computing Systems (JETC)
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An overview of wafer-level three-dimensional (3D)) integration technology is provided. The basic reasoning for pursuing 3D integration is presented, followed by a description of the possible process variations and integration schemes, as well as the process technology elements needed to implement 3D integrated circuits. Detailed descriptions of two wafer-level integration schemes implemented at IBM are given, and the challenges of bringing 3D integration into a production environment are discussed.