IBM System/390 air-cooled alumina thermal conduction module
IBM Journal of Research and Development
IBM Enterprise System/900 Type 9121 Model 320 air-cooled processor technology
IBM Journal of Research and Development
A half-micron CMOS logic generation
IBM Journal of Research and Development - Special issue: IBM CMOS technology
A power, packaging, and cooling overview of the IBM eServer z900
IBM Journal of Research and Development
High-end server low-temperature cooling
IBM Journal of Research and Development
Thin-film multichip module packages for high-end IBM servers
IBM Journal of Research and Development - Electrochemical microfabrication
Systems research challenges: a scale-out perspective
IBM Journal of Research and Development
Silicon carrier for computer systems
Proceedings of the 43rd annual Design Automation Conference
IBM Journal of Research and Development - POWER5 and packaging
Three-dimensional integrated circuits
IBM Journal of Research and Development - Advanced silicon technology
IBM POWER6 microprocessor physical design and design methodology
IBM Journal of Research and Development
Is 3D chip technology the next growth engine for performance improvement?
IBM Journal of Research and Development
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
IBM Journal of Research and Development
Wafer-level 3D integration technology
IBM Journal of Research and Development
3D chip stacking with C4 technology
IBM Journal of Research and Development
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
IBM Journal of Research and Development
Through-silicon vias enable next-generation SiGe power amplifiers forwireless communications
IBM Journal of Research and Development
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Proceedings of the 11th international workshop on System level interconnect prediction
A study of Through-Silicon-Via impact on the 3D stacked IC layout
Proceedings of the 2009 International Conference on Computer-Aided Design
Low-power 3D nano/CMOS hybrid dynamically reconfigurable architecture
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Electrochemical investigations for copper electrodeposition of through-silicon via
Microelectronic Engineering
Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Is 3D integration an opportunity or just a hype?
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Pinned to the walls: impact of packaging and application properties on the memory and power walls
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
Layout effects in fine grain 3D integrated regular microprocessor blocks
Proceedings of the 48th Design Automation Conference
Toward five-dimensional scaling: how density improves efficiency in future computers
IBM Journal of Research and Development
Power management and its impact on power supply noise
PATMOS'09 Proceedings of the 19th international conference on Integrated Circuit and System Design: power and Timing Modeling, Optimization and Simulation
Proceedings of the International Conference on Computer-Aided Design
Architecture and performance evaluation of 3D CMOS-NEM FPGA
Proceedings of the System Level Interconnect Prediction Workshop
Near-threshold operation for power-efficient computing?: it depends...
Proceedings of the 49th Annual Design Automation Conference
A scalable and fault-tolerant network routing scheme for many-core and multi-chip systems
Journal of Parallel and Distributed Computing
Modeling and analysis of power distribution networks in 3-D ICs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
On effective TSV repair for 3D-stacked ICs
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Centip3De: a many-core prototype exploring 3D integration and near-threshold computing
Communications of the ACM
Microelectronic Engineering
| Hi-index | 0.02 |
Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration technologies can include the following: power efficiency, performance enhancements, significant product miniaturization, cost reduction, and modular design for improved time to market. IBM research activities are aimed at providing design rules, structures, and processes that make 3D technology manufacturable for chips used in actual products on the basis of data from test-vehicle (i.e., prototype) design, fabrication, and characterization demonstrations. Three-dimensional integration can be applied to a wide range of interconnection densities (2 to 108/cm2), requiring new architectures for product optimization and multiple options for fabrication. Demonstration test structures, which are designed, fabricated, and characterized, are used to generate experimental data, establish models and design guidelines, and help define processes for future product consideration. This paper 1) reviews technology integration from a historical perspective, 2) describes industry-wide progress in 3D technology with examples of TSV and silicon-silicon interconnection advancement over the last 10 years, 3) highlights 3D technology from IBM, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and 4) provides examples of 3D emerging industry product applications that could create marketable systems.