Architecture and CAD for Deep-Submicron FPGAs
Architecture and CAD for Deep-Submicron FPGAs
Demystifying 3D ICs: The Pros and Cons of Going Vertical
IEEE Design & Test
DAOmap: a depth-optimal area optimization mapping algorithm for FPGA designs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Performance benefits of monolithically stacked 3D-FPGA
Proceedings of the 2006 ACM/SIGDA 14th international symposium on Field programmable gate arrays
Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays
Three-dimensional silicon integration
IBM Journal of Research and Development
Wafer-level 3D integration technology
IBM Journal of Research and Development
Efficient FPGAs using nanoelectromechanical relays
Proceedings of the 18th annual ACM/SIGDA international symposium on Field programmable gate arrays
The effect of LUT and cluster size on deep-submicron FPGA performance and density
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on the 2002 international symposium on low-power electronics and design (ISLPED)
Nano-electro-mechanical relays for FPGA routing: experimental demonstration and a design technique
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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In this paper, we introduce a reconfigurable architecture, named 3D CMOS-NEM FPGA, which utilizes Nanoelectromechanical (NEM) relays and 3D integration techniques synergistically. Unique features of our architecture include: hybrid CMOS-NEM FPGA look-up tables (LUTs) and configurable logic blocks (CLBs), NEM-based switch blocks (SBs) and connection blocks (CBs), and face-to-face 3D stacking. This architecture also has a built-in feature named direct link which is dedicated local communication channel using the short vertical wire between the two stacks to further enhance performance. A customized 3D FPGA placement and routing flow has been developed. By replacing CMOS components with NEM relays, a 19.5% delay reduction can be achieved compared to the baseline 2D CMOS architecture. 3D stacking together with NEM devices achieves a 31.5% delay reduction over the baseline. The best performance of this architecture is achieved by adding direct links, which provides a 41.9% performance gain over the baseline.