IBM System/390 air-cooled alumina thermal conduction module
IBM Journal of Research and Development
MCM technology and design for the S/390 G5 system
IBM Journal of Research and Development
Self-timed interface for S/390 I/O subsystem interconnection
IBM Journal of Research and Development
IBM Journal of Research and Development
Modular server frame with robust earthquake retention
IBM Journal of Research and Development
First- and second-level packaging of the z990 processor cage
IBM Journal of Research and Development
Packaging the IBM eServer z990 central electronic complex
IBM Journal of Research and Development
Hybrid cooling with cycle steering in the IBM eServer z990
IBM Journal of Research and Development
Three-dimensional silicon integration
IBM Journal of Research and Development
Packaging the Blue Gene/L supercomputer
IBM Journal of Research and Development
Packaging design of the IBM system z10 enterprise class platform central electronic complex
IBM Journal of Research and Development
Electronic packaging of the IBM System z196 enterprise-class server processor cage
IBM Journal of Research and Development
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This paper provides an overview of the power, packaging, and cooling aspects of the IBM eServer z900 design. The semiconductor processor chips must be supported and protected in a mechanical structure that has to provide electrical interconnects while maintaining the chip junction temperature within specified limits. The mechanical structure should be able to withstand shock and vibrations during transportation or events such as earthquakes. The processor chips require electrical power at well-regulated voltages, unaffected by the ac-line voltage and load current fluctuations. The acoustical and electromagnetic noise produced by the hardware must be within the limits set by national regulatory agencies, and the electronic operations must be adequately protected from disruption caused by electromagnetic radiation. For high availability, the power, packaging, and cooling hardware must have redundancy and the ability to be maintained while the system is operating. This paper first overviews the packaging hardware, followed by a description of the first- and second-level packaging, which includes the mother board and the multichip module. Thermal management is discussed from the point of view of both the multichip module and the overall system. Power conversion, management, and distribution are presented next. Finally, the design aspects involved with meeting the requirements of electromagnetic compatibility, acoustics, and immunity to shock, vibration, and earthquakes are discussed.