Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system

Authors:
Minki Cho;Chang Liu;Dae Hyun Kim;Sung Kyu Lim;Saibal Mukhopadhyay
Affiliations:
Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA
Venue:
Proceedings of the International Conference on Computer-Aided Design
Year:
2010

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Abstract

In this paper we present a test structure and design methodology for testing, characterization, and self-repair of TSVs in 3D ICs. The proposed structure can detect the signal degradation through TSVs due to resistive shorts and variations in TSV. For TSVs with moderate signal degradations, the proposed structure reconfigures itself as signal recovery circuit to improve signal fidelity. The paper presents the design of the test/recovery structure, the test methodologies, and demonstrates its effectiveness through stand alone simulations as well as in a full-chip physical design of a 3D IC.