Homogeneous integration for 3D IC with TSV

Authors:
Ding-Ming Kwai
Affiliations:
SoC Technology Center, Industrial Technology Research Institute, Hsinchu, Taiwan
Venue:
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Year:
2010

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Abstract

Three-dimensional (3D) integration with through-silicon via (TSV) is an emerging technology which has been expected to lead to an industry paradigm shift. Will the industry steam forward with the gusto of 3D IC with TSV? I consider its success in homogeneous integration by looking forward the solution to the following three awareness problems: variability, TSV, and thermal.