Interconnect characteristics of 2.5-D system integration scheme
Proceedings of the 2001 international symposium on Physical design
Congestion reduction during placement with provably good approximation bound
ACM Transactions on Design Automation of Electronic Systems (TODAES)
APlace: a general analytic placement framework
Proceedings of the 2005 international symposium on Physical design
Design tools for 3-D integrated circuits
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
mPL6: enhanced multilevel mixed-size placement
Proceedings of the 2006 international symposium on Physical design
NTUplace2: a hybrid placer using partitioning and analytical techniques
Proceedings of the 2006 international symposium on Physical design
Thermal-Aware 3D IC Placement Via Transformation
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Three-dimensional Integrated Circuit Design
Three-dimensional Integrated Circuit Design
Wafer-level 3D integration technology
IBM Journal of Research and Development
RegPlace: a high quality open-source placement framework for structured ASICs
Proceedings of the 46th Annual Design Automation Conference
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Ultra high density logic designs using transistor-level monolithic 3D integration
Proceedings of the International Conference on Computer-Aided Design
Power benefit study for ultra-high density transistor-level monolithic 3D ICs
Proceedings of the 50th Annual Design Automation Conference
Cell transformations and physical design techniques for 3D monolithic integrated circuits
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs
Proceedings of the 2014 on International symposium on physical design
Hi-index | 0.00 |
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequential order, the size of the vertical contacts is similar to traditional contacts unlike in the case of parallel 3-D integration with through silicon vias (TSVs). Given the advantage of such small contacts, 3DMI enables manufacturing multiple active layers very close to each other. In this work we propose two different strategies of stacking standard cells in 3-D without breaking the regularity of the conventional design flow: a) Vertical stacking of diffusion areas (Intra-Cell stacking) that supports complete reuse of 2-D physical design tools and b) vertical stacking of cells over others (Cell-on-Cell stacking). A placement tool (CELONCEL-placer) targeting the Cell-on-Cell placement problem is proposed to allow high quality 3-D layout generation. Our experiments demonstrate the effectiveness of CELONCEL technique, fetching us an area gain of 37.5%, 15.51% reduction in wirelength, and 13.49% improvement in overall delay, compared with a 2-D case when benchmarked across an interconnect dominated low-density-parity-check (LDPC) decoder at 45nm technology node.