Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Temperature-aware routing in 3D ICs
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Forbidden transition free crosstalk avoidance CODEC design
Proceedings of the 45th annual Design Automation Conference
Pre-bond testable low-power clock tree design for 3D stacked ICs
Proceedings of the 2009 International Conference on Computer-Aided Design
ILP-based inter-die routing for 3D ICs
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Efficient on-chip crosstalk avoidance CODEC design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
Proceedings of the 48th Design Automation Conference
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Proceedings of the International Conference on Computer-Aided Design
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In 3D VLSI, through-silicon vias (TSVs) are relatively large, and closely spaced. This results in a situation in which noise on one or more TSVs may deteriorate the delay and signal integrity of neighboring TSVs. In this paper, we first quantify the parasitics in contemporary TSVs, and then come up with a classification of crosstalk sequences as OC, 1C,... 8C sequences. Next, we present inductive approaches to quantify the exact overhead for 8C, 6C and 4C crosstalk avoidance codes (CACs) for a 3 x n mesh arrangement of TSVs. These overheads for different CACs for a 3 x n mesh arrangement of TSVs are used to calculate the lower bounds on the corresponding overheads for an n x n mesh arrangements of TSVs. We also discuss an efficient way to implement the coding and decoding (CODEC) circuitry for limiting the maximum crosstalk to 6C. Our experimental results show that for a TSV mesh arrangement driven by inverters implemented in a 22nm technology, the coding based approaches yields improvements which are in line with the theoretical predictions.