ILP-based inter-die routing for 3D ICs

  • Authors:
  • Chia-Jen Chang;Pao-Jen Huang;Tai-Chen Chen;Chien-Nan Jimmy Liu

  • Affiliations:
  • National Central University, Taiwan;National Central University, Taiwan;National Central University, Taiwan;National Central University, Taiwan

  • Venue:
  • Proceedings of the 16th Asia and South Pacific Design Automation Conference
  • Year:
  • 2011

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Abstract

The 3D IC is an emerging technology. The primary emphasis on 3D-IC routing is the interface issues across dies. To handle the interface issue of connections, the inter-die routing, which uses micro bumps and two single-layer RDLs (Re-Distribution Layers) to achieve the connection between adjacent dies, is adopted. In this paper, we present an inter-die routing algorithm for 3D ICs with a pre-defined netlist. Our algorithm is based on integer linear programming (ILP) and adopts a two-stage technique of micro-bump assignment followed by non-regular RDL routing. First, the micro-bump assignment selects suitable micro-bumps for the pre-defined netlist such that no crossing problem exists inside the bounding boxes of each net. After the micro-bump assignment, the netlist is divided into two sub-netlists, one is for the upper RDL and the other is for the lower RDL. Second, the non-regular RDL routing determines minimum and non-crossing global paths for sub-netlists in the upper and lower RDLs individually. Experimental results show that our approach can obtain optimal wirelength and achieve 100% routability under reasonable CPU times.