Cost evaluation on reuse of generic network service dies in three-dimensional integrated circuits

Authors:
Ji Wu;Gaofeng Wang
Affiliations:
School of Computer Science, Wuhan University, Wuhan, Hubei 430072, China and Institute of Microelectronics and Information Technology, School of Electronic Information, Wuhan University, Wuhan, Hu ...;School of Computer Science and Education Software, Guangzhou University, Guangzhou, Guangdong 510006, China and Institute of Microelectronics and Information Technology, School of Electronic Infor ...
Venue:
Microelectronics Journal
Year:
2013

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Abstract

Reuse of existing designs is one of the most effective means for cost reduction. Three-dimensional (3D) stacking technology makes possible reuse of dies in 3D stack. GNet - a 3D architecture for reusing generic network service dies - is herein proposed to construct a network-on-chip (NoC) by virtue of exploiting reuse of known good dies (KGDs). In GNet, generic network service dies (GNSDs) are KGDs that integrate several networks and can be directly used to bond with other dies in 3D stack. Flexible and configurable design of GNet makes it suitable to requirements in various application circumstances. A comprehensive cost model, which combines the design cost model, reuse model and fabrication model, is introduced to evaluate different architectures from the design phase to the fabrication phase. Experiments show that GNet is more cost efficient than the general 3D implementations.