Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Unified quadratic programming approach for mixed mode placement
Proceedings of the 2005 international symposium on Physical design
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Design tools for 3-D integrated circuits
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
Thermal-Aware 3D IC Placement Via Transformation
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Proceedings of the 48th Design Automation Conference
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Three-dimensional (3D) ICs have the potential to reduce the interconnect delay, but thermal problem becomes one of the most serious challenges. In this paper, we proposed an efficient thermal aware 3D placement algorithm,which takes use of quadratic uniformity modeling approach. In this model, cell distribution and thermal dissipation are integrated and formulated as a quadratic function through discrete cosine transformation (DCT) with wirelength optimization. Quadratic programming method is utilized to solve the unified quadratic objective function. We update the unified cell distribution and thermal dissipation with each step of the iterative placement process. Thermal distribution was considered enough during placement process even when a cell was moved. To save time, two fast methods to reflect thermal change were proposed for thermal distribution computation. The experimental results show our thermal aware 3D placement algorithm is efficient with about 3% reduction in average temperature and 15% in max temperature but a little perturbation on wire length.