Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Three-Dimensional Cache Design Exploration Using 3DCacti
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Temperature-aware routing in 3D ICs
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Thermal via planning for 3-D ICs
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Techniques for Multicore Thermal Management: Classification and New Exploration
Proceedings of the 33rd annual international symposium on Computer Architecture
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Proceedings of the 43rd annual Design Automation Conference
Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation
IEEE Transactions on Computers
Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Networks-on-chip in emerging interconnect paradigms: Advantages and challenges
NOCS '09 Proceedings of the 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip
Thermal modeling for 3D-ICs with integrated microchannel cooling
Proceedings of the 2009 International Conference on Computer-Aided Design
TAPE: thermal-aware agent-based power economy for multi/many-core architectures
Proceedings of the 2009 International Conference on Computer-Aided Design
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Proceedings of the 2009 International Conference on Computer-Aided Design
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
Proceedings of the International Conference on Computer-Aided Design
Temperature and supply Voltage aware performance and power modeling at microarchitecture level
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
System-Level Dynamic Thermal Management for High-Performance Microprocessors
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
| Hi-index | 0.00 |
Heat removal problem has been a bane of three dimensional integrated circuits (3DICs). Comparing with other passive cooling techniques, microfluidic cooling appears to be an ideal cooling solution due to its high thermal conductivity and scalability. Without regarding to the fact of non-uniform power distribution of integrated circuits, existing microfluidic cooling with uniform cooling effort incurs large thermal gradient and wastes pump power. This can be avoided by the customized non-uniform cooling scheme proposed in this paper. The microfluidic channels are divided into clusters of relatively homogeneous power distribution and an appropriate flow rate setting is applied to each cluster based on the total flow rate and the maximum allowable temperature of the 3DIC. This paper proposes an efficient clustering algorithm to guide the division of microchannels into clusters and the allocation of cooling resources to each cluster in order to achieve an effective microfluidic cooling with minimal total flow rate. A compact steady state thermal simulator has been developed and verified. Supported by this fast and accurate thermal model, the proposed cooling method and clustering algorithm have been applied to a 3D multi-core testbench for simulation. Compared to the uniform flow rate cooling, the maximum temperature and thermal gradient were reduced under the same total flow rate settings. On the other hand, for a specific peak temperature constraint, up to 21.8% saving in total flow rate with moderate thermal gradients is achieved by the proposed clustered microfluidic cooling.