Networks-on-chip in emerging interconnect paradigms: Advantages and challenges

  • Authors:
  • Luca P. Carloni;Partha Pande;Yuan Xie

  • Affiliations:
  • Columbia University, USA;Washington State University, USA;Pennsylvania State University, USA

  • Venue:
  • NOCS '09 Proceedings of the 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip
  • Year:
  • 2009

Quantified Score

Hi-index 0.00

Visualization

Abstract

Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simplify and optimize SoC design. However, it is expected that improving traditional communication technologies and interconnect organizationswill not be sufficient to satisfy the demand for energy-efficient and high-performance interconnect fabrics, which continues to grow with each new process generation. Multiple options have been envisioned as compelling alternatives to the existing planar metal/dielectric communication structures. In this paper we outline the opportunities and challenges associated with three emerging interconnect paradigms: three-dimensional (3-D) integration, nanophotonic communication, and wireless interconnects.