Low-string on-chip signaling techniques: effectiveness and robustness
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Special section on low-power electronics and design
Interconnect-power dissipation in a microprocessor
Proceedings of the 2004 international workshop on System level interconnect prediction
Design of ultrahigh-speed low-voltage CMOS CML buffers and latches
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
An Energy-Efficient Reconfigurable Circuit-Switched Network-on-Chip
IPDPS '05 Proceedings of the 19th IEEE International Parallel and Distributed Processing Symposium (IPDPS'05) - Workshop 3 - Volume 04
Randomized Partially-Minimal Routing on Three-Dimensional Mesh Networks
IEEE Computer Architecture Letters
Efficient and accurate eye diagram prediction for high speed signaling
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
ISQED '09 Proceedings of the 2009 10th International Symposium on Quality of Electronic Design
Networks-on-chip in emerging interconnect paradigms: Advantages and challenges
NOCS '09 Proceedings of the 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip
Designing Energy-Efficient Low-Diameter On-Chip Networks with Equalized Interconnects
HOTI '09 Proceedings of the 2009 17th IEEE Symposium on High Performance Interconnects
ATAC: a 1000-core cache-coherent processor with on-chip optical network
Proceedings of the 19th international conference on Parallel architectures and compilation techniques
Low-power, high-speed transceivers for network-on-chip communication
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A case for globally shared-medium on-chip interconnect
Proceedings of the 38th annual international symposium on Computer architecture
A low-swing crossbar and link generator for low-power networks-on-chip
Proceedings of the International Conference on Computer-Aided Design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Prediction and Comparison of High-Performance On-Chip Global Interconnection
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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Based on current trends in multicore scaling, chips with 1024 cores may be available within the next decade. For such number of cores, cache coherence becomes a critical challenge because of the broadcasting operation. For the conventional electrical mesh interconnect network, broadcasting common data to all the cores is difficult to perform efficiently. In this paper, we developed a high-throughput, low-latency and power-efficient equalized dense transmission line (T-line) structure tailored for efficient global broadcasting. Moreover, we propose a hierarchical architecture and an efficient physical structure for 1024-core communication. Evaluation results show high performance of our solution.