RF interconnects for communications on-chip

  • Authors:
  • M.-C. Frank Chang;Eran Socher;Sai-Wang Tam;Jason Cong;Glenn Reinman

  • Affiliations:
  • UCLA, Los Angeles, CA, USA;UCLA, Los Angeles, CA, USA;UCLA, Los Angeles, CA, USA;UCLA, Los Angeles, CA, USA;UCLA, Los Angeles, CA, USA

  • Venue:
  • Proceedings of the 2008 international symposium on Physical design
  • Year:
  • 2008

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Abstract

In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well