A design space exploration of transmission-line links for on-chip interconnect

  • Authors:
  • Aaron Carpenter;Jianyun Hu;Michael Huang;Hui Wu;Peng Liu

  • Affiliations:
  • University of Rochester, Rochester, NY, USA;University of Rochester, Rochester, NY, USA;University of Rochester, Rochester, NY, USA;University of Rochester, Rochester, NY, USA;University of Rochester, Rochester, NY, USA

  • Venue:
  • Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
  • Year:
  • 2011

Quantified Score

Hi-index 0.00

Visualization

Abstract

With increasing core count, chip multiprocessors (CMP) require a high-performance interconnect fabric that is energy-efficient. Well-engineered transmission line-based communication systems offer an attractive solution, especially for CMPs with a moderate number of cores. While transmission lines have been used in a wide variety of purposes, there lack comprehensive studies to guide architects to navigate the circuit and physical design space to make proper architecture-level analyses and tradeoffs. This paper makes a first-step effort in exploring part of the design space. Using detailed simulation-based analysis, we show that a shared-medium fabric based on transmission line can offer better performance and a much better energy profile than a conventional mesh interconnect.