Power reduction of CMP communication networks via RF-interconnects

  • Authors:
  • M-C. Frank Chang;Jason Cong;Adam Kaplan;Chunyue Liu;Mishali Naik;Jagannath Premkumar;Glenn Reinman;Eran Socher;Sai-Wang Tam

  • Affiliations:
  • Electrical Engineering Department, UCLA, USA;Computer Science Department, UCLA, USA;Computer Science Department, UCLA, USA;Computer Science Department, UCLA, USA;Computer Science Department, UCLA, USA;Computer Science Department, UCLA, USA;Computer Science Department, UCLA, USA;Electrical Engineering Department, UCLA, USA;Electrical Engineering Department, UCLA, USA

  • Venue:
  • Proceedings of the 41st annual IEEE/ACM International Symposium on Microarchitecture
  • Year:
  • 2008

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Abstract

As chip multiprocessors scale to a greater number of processing cores, on-chip interconnection networks will experience dramatic increases in both bandwidth demand and power dissipation. Fortunately, promising gains can be realized via integration of Radio Frequency Interconnect (RF-I) through on-chip transmission lines with traditional interconnects implemented with RC wires. While prior work has considered the latency advantage of RF-I, we demonstrate three further advantages of RF-I: (1) RF-I bandwidth can be flexibly allocated to provide an adaptive NoC, (2) RF-I can enable a dramatic power and area reduction by simplification of NoC topology, and (3) RF-I provides natural and efficient support for multicast. In this paper, we propose a novel interconnect design, exploiting dynamic RF-I bandwidth allocation to realize a reconfigurable network-on-chip architecture. We find that our adaptive RF-I architecture on top of a mesh with 4B links can even outperform the baseline with 16B mesh links by about 1%, and reduces NoC power by approximately 65% including the overhead incurred for supporting RF-I.