Network flows: theory, algorithms, and applications
Network flows: theory, algorithms, and applications
Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
Non-uniform micro-channel design for stacked 3D-ICs
Proceedings of the 48th Design Automation Conference
Through-silicon-via management during 3D physical design: when to add and how many?
Proceedings of the International Conference on Computer-Aided Design
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
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Micro-channel based liquid cooling has significant capability of removing high density heat in 3D-ICs. The conventional micro-channel structures investigated for cooling 3D-ICs use straight channels. However, the presence of TSVs which form obstacles to the micro-channels prevents distribution of straight micro-channels. In this paper, we investigate the methodology of designing TSV-constrained micro-channel infrastructure. Specifically, we decide the locations and geometry of micro-channels with bended structure so that the cooling effectiveness is maximized. Our micro-channel structure could achieve up to 87% pumping power savings compared with the structure using straight micro-channels.