A linear-time heuristic for improving network partitions
DAC '82 Proceedings of the 19th Design Automation Conference
Large power grid analysis using domain decomposition
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Thermal-aware Steiner routing for 3D stacked ICs
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Proceedings of the 2009 International Conference on Computer-Aided Design
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
Spatial and temporal thermal characterization of stacked multicore architectures
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Cluster-based topologies for 3D Networks-on-Chip using advanced inter-layer bus architecture
Journal of Computer and System Sciences
Challenges in verifying an integrated 3D design
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the operating temperature of 3D ICs. In addition, designers use a highly complex hierarchical power distribution network in conjunction with decoupling capacitors to deliver currents to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. These so called silicon ancillary technologies, however, pose major challenges to routing completion and congestion. These thermal and power/ground interconnects together with those used for signal delivery compete with one another for routing resources including various types of Through-Silicon-Vias (TSVs). This paper presents the work on routing with these interconnects in 3D: signal, power, and thermal networks. We demonstrate how to consider various physical, electrical, and thermo-mechnical requirements of these interconnects to successfully complete routing while addressing various reliability concerns.