Interconnect characteristics of 2.5-D system integration scheme
Proceedings of the 2001 international symposium on Physical design
Digital Signal Processing
Placement algorithms for arbitrarily shaped blocks
DAC '79 Proceedings of the 16th Design Automation Conference
Calibration of rent's rule models for three-dimensional integrated circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Demystifying 3D ICs: The Pros and Cons of Going Vertical
IEEE Design & Test
Predicting the Performance of a 3D Processor-Memory Chip Stack
IEEE Design & Test
Design space exploration for 3D architectures
ACM Journal on Emerging Technologies in Computing Systems (JETC)
SBCCI '06 Proceedings of the 19th annual symposium on Integrated circuits and systems design
Pipeline and Parallel-Pipeline FFT Processors for VLSI Implementations
IEEE Transactions on Computers
A low power 3D integrated FFT engine using hypercube memory division
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
Design automation for a 3DIC FFT processor for synthetic aperture radar: a case study
Proceedings of the 46th Annual Design Automation Conference
Low-power and high-speed CORDIC-based split-radix FFT processor for OFDM systems
Digital Signal Processing
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Placement of thermal vias in 3-D ICs using various thermal objectives
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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In this article we demonstrate a floating point FFT processor that leverages both 3D integration and a unique hypercube memory division scheme to reduce the power consumption of a 1024 point FFT down to 4.227μJ. The hypercube memory division scheme lowers the energy per memory access by 59.2% and increases the total required area by 16.8%. The use of 3D integration reduces the logic power by 5.2%. We describe the tool flow required to realize the 3D implementation and perform a thermal analysis of it.