Interconnect characteristics of 2.5-D system integration scheme
Proceedings of the 2001 international symposium on Physical design
Demystifying 3D ICs: The Pros and Cons of Going Vertical
IEEE Design & Test
Design tools for 3-D integrated circuits
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
Design space exploration for 3D architectures
ACM Journal on Emerging Technologies in Computing Systems (JETC)
SBCCI '06 Proceedings of the 19th annual symposium on Integrated circuits and systems design
FreePDK: An Open-Source Variation-Aware Design Kit
MSE '07 Proceedings of the 2007 IEEE International Conference on Microelectronic Systems Education
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration
ACM Transactions on Design Automation of Electronic Systems (TODAES)
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In this paper we demonstrate a floating point FFT processor that leverages both 3D integration and a hypercube memory division scheme to reduce the power consumption of a 1024 point FFT down to 4.227 μJ. The hypercube memory division scheme lowers the energy per memory access by 59.2% while only increasing the total area required by 16.8%, while using 3D integration reduces the logic power by 5.2%. For comparison, we analyze the amount of power and wire length reduction that can be expected from 3D integration for normal digital logic circuits.