Predicting the Performance of a 3D Processor-Memory Chip Stack

  • Authors:
  • Philip Jacob;Okan Erdogan;Aamir Zia;Paul M. Belemjian;Russell P. Kraft;John F. McDonald

  • Affiliations:
  • Rensselaer Polytechnic Institute;Rensselaer Polytechnic Institute;Rensselaer Polytechnic Institute;Rensselaer Polytechnic Institute;Rensselaer Polytechnic Institute;Rensselaer Polytechnic Institute

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2005

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Abstract

A primary bottleneck in the performance of a processor is in its communication with memory. By allowing the placement of processor and memory in adjacent layers, 3D design provides significant relief, reducing the communication latency. This article studies the impact of 3D design bycomparing the cycles per instruction of such a design with various alternatives.