Performance and reliability analysis of computer systems: an example-based approach using the SHARPE software package
A generic architecture for on-chip packet-switched interconnections
DATE '00 Proceedings of the conference on Design, automation and test in Europe
Dynamic power management in a mobile multimedia system with guaranteed quality-of-service
Proceedings of the 38th annual Design Automation Conference
Analysis of power consumption on switch fabrics in network routers
Proceedings of the 39th annual Design Automation Conference
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
AR-SMT: A Microarchitectural Approach to Fault Tolerance in Microprocessors
FTCS '99 Proceedings of the Twenty-Ninth Annual International Symposium on Fault-Tolerant Computing
Trading off Reliability and Power-Consumption in Ultra-Low Power Systems
ISQED '02 Proceedings of the 3rd International Symposium on Quality Electronic Design
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Managing Power Consumption in Networks on Chip
Proceedings of the conference on Design, automation and test in Europe
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
A Network on Chip Architecture and Design Methodology
ISVLSI '02 Proceedings of the IEEE Computer Society Annual Symposium on VLSI
Networks on chip
Exploiting Microarchitectural Redundancy For Defect Tolerance
ICCD '03 Proceedings of the 21st International Conference on Computer Design
Razor: A Low-Power Pipeline Based on Circuit-Level Timing Speculation
Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture
Dynamic Fault-Tolerance and Metrics for Battery Powered, Failure-Prone Systems
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Reliability and Power Management of Integrated Systems
DSD '04 Proceedings of the Digital System Design, EUROMICRO Systems
DATE '03 Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
Thermal Modeling, Characterization and Management of On-Chip Networks
Proceedings of the 37th annual IEEE/ACM International Symposium on Microarchitecture
Exploiting Structural Duplication for Lifetime Reliability Enhancement
Proceedings of the 32nd annual international symposium on Computer Architecture
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Reliability-aware design for nanometer-scale devices
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Temperature management in multiprocessor SoCs using online learning
Proceedings of the 45th annual Design Automation Conference
Proactive temperature management in MPSoCs
Proceedings of the 13th international symposium on Low power electronics and design
Proactive temperature balancing for low cost thermal management in MPSoCs
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Static and dynamic temperature-aware scheduling for multiprocessor SoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Proceedings of the eleventh international joint conference on Measurement and modeling of computer systems
An outlook on design technologies for future integrated systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Processor speed control with thermal constraints
IEEE Transactions on Circuits and Systems Part I: Regular Papers
Utilizing predictors for efficient thermal management in multiprocessor SoCs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3D stacked power distribution considering substrate coupling
ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
AgeSim: a simulation framework for evaluating the lifetime reliability of processor-based SoCs
Proceedings of the Conference on Design, Automation and Test in Europe
Cost-effective slack allocation for lifetime improvement in NoC-based MPSoCs
Proceedings of the Conference on Design, Automation and Test in Europe
Reliability aware through silicon via planning for 3D stacked ICs
Proceedings of the Conference on Design, Automation and Test in Europe
Dynamic thermal management in 3D multicore architectures
Proceedings of the Conference on Design, Automation and Test in Europe
System-level reliability modeling for MPSoCs
CODES/ISSS '10 Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
Reliability-aware platform optimization for 3D chip multi-processors
The Journal of Supercomputing
Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A variation tolerant current-mode signaling scheme for on-chip interconnects
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Cost-effective lifetime and yield optimization for NoC-based MPSoCs
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Price theory based power management for heterogeneous multi-cores
Proceedings of the 19th international conference on Architectural support for programming languages and operating systems
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Today's embedded systems integrate multiple IP cores for processing, communication, and sensing on a single die as systems-on-chip (SoCs). Aggressive transistor scaling, decreased voltage margins and increased processor power and temperature have made reliability assessment a much more significant issue. Although reliability of devices and interconnect has been broadly studied, in this work, we study a tradeoff between reliability and power consumption for component-based SoC designs. We specifically focus on hard error rates as they cause a device to permanently stop operating. We also present a joint reliability and power management optimization problem whose solution is an optimal management policy. When careful joint policy optimization is performed, we obtain a significant improvement in energy consumption (40%) in tandem with meeting a reliability constraint for all SoC operating temperatures.