Power-aware scheduling under timing constraints for mission-critical embedded systems
Proceedings of the 38th annual Design Automation Conference
Task scheduling and voltage selection for energy minimization
Proceedings of the 39th annual Design Automation Conference
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Proceedings of the conference on Design, automation and test in Europe - Volume 1
The Case for Lifetime Reliability-Aware Microprocessors
Proceedings of the 31st annual international symposium on Computer architecture
Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
ASPLOS XI Proceedings of the 11th international conference on Architectural support for programming languages and operating systems
Thermal-Aware Task Allocation and Scheduling for Embedded Systems
Proceedings of the conference on Design, Automation and Test in Europe - Volume 2
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Compiler-directed thermal management for VLIW functional units
Proceedings of the 2006 ACM SIGPLAN/SIGBED conference on Language, compilers, and tool support for embedded systems
Techniques for Multicore Thermal Management: Classification and New Exploration
Proceedings of the 33rd annual international symposium on Computer Architecture
HybDTM: a coordinated hardware-software approach for dynamic thermal management
Proceedings of the 43rd annual Design Automation Conference
A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip
Proceedings of the 43rd annual Design Automation Conference
Temperature aware task scheduling in MPSoCs
Proceedings of the conference on Design, automation and test in Europe
Power and reliability management of SoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Reliability-aware design for nanometer-scale devices
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Predict and act: dynamic thermal management for multi-core processors
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
Accurate temperature estimation using noisy thermal sensors
Proceedings of the 46th Annual Design Automation Conference
Consistent runtime thermal prediction and control through workload phase detection
Proceedings of the 47th Design Automation Conference
Adaptive and autonomous thermal tracking for high performance computing systems
Proceedings of the 47th Design Automation Conference
Distributed task migration for thermal management in many-core systems
Proceedings of the 47th Design Automation Conference
Dynamic thermal management for single and multicore processors under soft thermal constraints
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Cool and save: cooling aware dynamic workload scheduling in multi-socket CPU systems
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
NEMS based thermal management for 3D many-core system
NANOARCH '11 Proceedings of the 2011 IEEE/ACM International Symposium on Nanoscale Architectures
Fan-speed-aware scheduling of data intensive jobs
Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
Multi-level simultaneous multithreading scheduling to reduce the temperature of register files
Concurrency and Computation: Practice & Experience
Temperature aware thread block scheduling in GPGPUs
Proceedings of the 50th Annual Design Automation Conference
CoMETC: Coordinated management of energy/thermal/cooling in servers
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Performance-driven dynamic thermal management of MPSoC based on task rescheduling
ACM Transactions on Design Automation of Electronic Systems (TODAES)
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Preventing thermal hot spots and large temperature variations on the die is critical for addressing the challenges in system reliability, performance, cooling cost and leakage power. Reactive thermal management methods, which take action after temperature reaches a given threshold, maintain the temperature below a critical level at the cost of performance, and do not address the temperature variations. In this work, we propose a proactive thermal management approach, which estimates the future temperature using regression, and allocates workload on a multicore system to reduce and balance the temperature to avoid temperature induced problems. Our technique reduces the hot spots and temperature variations significantly in comparison to reactive strategies.