Exploiting power budgeting in thermal-aware dynamic placement for reconfigurable systems

Authors:
Shahin Golshan;Eli Bozorgzadeh;Benjamin C. Schafer;Kazutoshi Wakabayashi;Houman Homayoun;Alex Veidenbaum
Affiliations:
Center of Embedded Computer Systems, University of California, Irvine, Irvine, CA, USA;Center of Embedded Computer Systems, University of California, Irvine, Irvine, CA, USA;NEC Corp., Central Research Laboratories, Kawasaki, Japan;NEC Corp., Central Research Laboratories, Kawasaki, Japan;Center of Embedded Computer Systems, University of California, Irvine, Irvine, CA, USA;Center of Embedded Computer Systems, University of California, Irvine, Irvine, CA, USA
Venue:
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Year:
2010

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Abstract

In this paper, a novel thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving time-consuming differential equations to obtain the hotspots, we propose a fast and accurate heuristic model based on power budgeting to plan the dynamic placements of the design statically, while considering the boundary conditions. Based on our heuristic model, we have developed a fast optimization technique to plan the dynamic placements at design time. Our results indicate that our technique is two orders of magnitude faster while the quality of the placements generated in terms of temperature and interconnection overhead is the same, if not better, compared to the thermal-aware placement techniques which perform thermal simulations inside the search engine.