Dynamic thermal management using thin-film thermoelectric cooling

  • Authors:
  • Pedro Chaparro;José González;Qiong Cai;Greg Chrysler

  • Affiliations:
  • Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain;Intel, Barcelona, Spain;Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain;Intel, Santa Clara, USA

  • Venue:
  • Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
  • Year:
  • 2009

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Abstract

Multi-core architectures require Dynamic Thermal Management mechanisms (DTM) to handle (1) multiple hotspots and (2) global chip heating effect while finding the best trade-off between performance and thermal control. In that scenario Thin-Film Thermoelectric Cooling devices can be used to mitigate both effects since they provide on-die localized cooling with a dynamic and heterogeneous effect. This work proposes controlling TFTECs from the microarchitecture for an enhanced Dynamic Thermal Management in multi-core architectures. We show that by using our TFTEC-based proposals the performance is within 8% of that of a thermally-unconstrained processor.