Feedback control systems (3rd ed.)
Feedback control systems (3rd ed.)
Reducing power in high-performance microprocessors
DAC '98 Proceedings of the 35th annual Design Automation Conference
The design and use of simplepower: a cycle-accurate energy estimation tool
Proceedings of the 37th Annual Design Automation Conference
Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
A static power model for architects
Proceedings of the 33rd annual ACM/IEEE international symposium on Microarchitecture
Design of High-Performance Microprocessor Circuits
Design of High-Performance Microprocessor Circuits
TEM2P2EST: A Thermal Enabled Multi-model Power/Performance ESTimator
PACS '00 Proceedings of the First International Workshop on Power-Aware Computer Systems-Revised Papers
Leakage power modeling and reduction with data retention
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
A 1.5GHz third generation itanium® 2 processor
Proceedings of the 40th annual Design Automation Conference
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Microarchitecture level power and thermal simulation considering temperature dependent leakage model
Proceedings of the 2003 international symposium on Low power electronics and design
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
Static Energy Reduction Techniques for Microprocessor Caches
ICCD '01 Proceedings of the International Conference on Computer Design: VLSI in Computers & Processors
The need for a full-chip and package thermal model for thermally optimized IC designs
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Microarchitecture-level leakage reduction with data retention
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Thermal-aware scheduling for future chip multiprocessors
EURASIP Journal on Embedded Systems
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Power is rapidly becoming the primary design constraint for systems ranging from server computers to handhelds. In this paper we study microarchitecture-level coupled power and thermal simulation considering dynamic and leakage power models with temperature and voltage scaling. We develop an accurate temperature-dependent leakage power model and efficient temperature calculation, and show that leakage energy can be different by up to 10X for temperatures between 35oC and 110oC. Given the growing significance of leakage power and its sensitive dependence on temperature, no power simulation without considering dynamic temperature calculation is accurate. Furthermore, we discuss the thermal runaway induced by the interdependence between leakage power and temperature, and show that in the near future thermal runaway could be a severe problem. We also study the microarchitecture level coupled power and thermal management by novel active cooling techniques that reduce packaging thermal resistance. We show that the direct water-spray cooling technique reduces thermal resistance from 0.8oC/W for conventional packaging to 0.05oC/W, and increases system maximum clock by up to 2.44X under the same thermal constraints.