Microarchitecture level power and thermal simulation considering temperature dependent leakage model

Authors:
Weiping Liao;Fei Li;Lei He
Affiliations:
University of California at Los Angeles, Los Angeles, CA;University of California at Los Angeles, Los Angeles, CA;University of California at Los Angeles, Los Angeles, CA
Venue:
Proceedings of the 2003 international symposium on Low power electronics and design
Year:
2003

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Abstract

In this paper, we present power models with clock and temperature scaling, and develop the first of its type coupled thermal and power simulation with temperature-dependent leakage power model at micro-architecture level. We show that leakage energy and total energy can be different by up to 2.5X and 2X for temperatures between 90°C and 130°C, respectively. Given such big energy variations, no power model at microarchitecture level is accurate without considering temperature dependent leakage models.