Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
The Alpha 21264 Microprocessor
IEEE Micro
Basic Block Distribution Analysis to Find Periodic Behavior and Simulation Points in Applications
Proceedings of the 2001 International Conference on Parallel Architectures and Compilation Techniques
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Active bank switching for temperature control of the register file in a microprocessor
Proceedings of the 17th ACM Great Lakes symposium on VLSI
Compiler-driven register re-assignment for register file power-density and temperature reduction
Proceedings of the 45th annual Design Automation Conference
COOL: control-based optimization of load-balancing for thermal behavior
Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
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The manufacturing process of microprocessors becomes increasingly fine and the clock frequency is rapidly growing. Since the corresponding power consumption, however, is not reduced, power density is increased dramatically. The generated heat by the power density induces high temperature. The high temperature causes many problems: calculation errors, aging, leakage power, and cooling costs. Register file produces the highest temperature in a microprocessor because of extremely high access frequency and its small area. We demonstrated that the existing renaming unit causes high temperature since it allocates registers imbalanced. Our idea is to redistribute evenly register allocations and accesses across the full range of the register file; consequently, the overall power density is reduced and then the temperature is lowered. The proposed method can be implemented by adding a small logic to the traditional renaming unit with around 1.5% overheads. As a result, temperature drop was up to 10.4°C (11%) on average 4.6°C (6%). We also achieved leakage power savings and performance improvements by the temperature drop.