Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects

Authors:
Ki Jin Han;Madhavan Swaminathan;Ege Engin
Affiliations:
Georgia Institute of Technology, Atlanta, Georgia;Georgia Institute of Technology, Atlanta, Georgia;Georgia Institute of Technology, Atlanta, Georgia
Venue:
Proceedings of the 45th annual Design Automation Conference
Year:
2008

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Cited 1

Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

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Abstract

For the modeling of interconnect in three-dimensional packagings, this paper proposes a method based on the electric field integral equation (EFIE) with cylindrical conduction mode basis functions (CMBF). The bases are defined to describe arbitrary skin and proximity effects, and partial impedances are obtained from the formulation of the EFIE with CMBF's. Examples of several 3-D interconnects verify that the proposed method is efficient in speed and memory.