Inductance and resistance calculations in three-dimensional packaging using cylindrical conduction-mode basis functions

Authors:
Ki Jin Han;Madhavan Swaminathan
Affiliations:
School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA;School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA
Venue:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Year:
2009

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Abstract

For the successful electrical design of system-in-package, this paper proposes an efficient method for extracting wideband resistance and inductance from a large number of 3-D interconnections. The proposed method uses the modal equivalent network from the electric field integral equation with cylindrical conduction-mode basis function, which reduces the matrix size for large 3-D interconnection problems. Additional enhancement schemes proposed further reduce the cost for computing the partial inductances. Therefore, the method discussed in this paper can be used to construct accurate models of a large number of 3-D interconnection structures such as more than 100 bonding wires used for stacking chips.