Prospects for WSI: A Manufacturing Perspective
Computer - Special issue on wafer-scale integration
An Evaluation of Starburst's Memory Resident Storage Component
IEEE Transactions on Knowledge and Data Engineering
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The revival in optical lithography resulting from continuing advances in photoresists, phase-shifting masks, high-numerical-aperture step-and-repeat optical systems, multilevel-resist processing, and top-surface imaging techniques is discussed. Optical lithography is being used to make advanced IC chips, with 0.35 μm geometries in research, 0.5 μm in production. Ultraviolet (UV) light in the 200-400 nm range is the predominant system for IC manufacturing technology. Deep-UV lithography is not yet accepted for production processes, mostly due to the lack of commercially available positive and negative-tone photoresist systems for deep-UV wavelengths. In addition, negative-tone resists are temperature-sensitive and therefore hard to handle in a manufacturing environment, extensive gas-handling facilities are required for deep-UV excimer laser sources, and optical components have to be replaced often because the intense laser energy devitrifies lenses quickly